Process Technology | |
---|---|
Fabricated By | TI |
Process | http://cpudb.stanford.edu/technologies/103 |
Technology | CMOS |
Feature Size [μm] | 0.13 |
Channel Length [μm] | |
Metal Layers | 7 |
Metal Type | copper |
FO4 Delay [ps] | 25.2 |
Year | |
Nominal Vdd | 1.40 |
Vth* | 0.5 |
Designer | Family | Code Name | Model | μarch | Released | Cache | Vdd | Feature Size | FO4 | Clock | TDP | SPECInt 1992 | SPECFp 1992 | SPECInt 1995 | SPECFp 1995 | SPECInt 2000 | SPECFp 2000 | SPECInt 2006 | SPECFp 2006 | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Sun | UltraSPARC III Cu | Cheetah+ | 96 | 1.60 | 0.13 | 25.2 | 1015.0 | 80.0 | 513.5 | 685.0 | details | |||||||||
Sun | UltraSPARC III Cu | Cheetah+ | 96 | 1.60 | 0.13 | 25.2 | 1050.0 | 80.0 | 550.9 | 768.0 | details | |||||||||
Sun | UltraSPARC III Cu | Cheetah+ | 96 | 1.60 | 0.13 | 25.2 | 1200.0 | 80.0 | 630.1 | 926.3 | details | |||||||||
Sun | UltraSPARC IIIi | Jalepeno | 1024 | 1.30 | 0.13 | 25.2 | 1002.0 | 52.0 | 483.5 | 720.0 | details | |||||||||
Sun | UltraSPARC IIIi | Jalepeno | 1024 | 1.30 | 0.13 | 25.2 | 1062.0 | 52.0 | 513.0 | 757.0 | details | |||||||||
Sun | UltraSPARC IIIi | Jalepeno | 1024 | 1.30 | 0.13 | 25.2 | 1280.0 | 52.0 | 609.7 | 927.3 | details | |||||||||
Sun | UltraSPARC IIIi | Jalepeno | 1024 | 1.30 | 0.13 | 25.2 | 1336.0 | 52.0 | 635.8 | 1023.4 | details | |||||||||
Sun | UltraSPARC IIIi | Jalepeno | 1024 | 1.30 | 0.13 | 25.2 | 1503.0 | 52.0 | 697.5 | 1134.5 | details | |||||||||
Sun | UltraSPARC IIIi | Jalepeno | 1024 | 1.30 | 0.13 | 25.2 | 1600.0 | 52.0 | 753.5 | 1230.4 | details |