Process Technology | |
---|---|
Fabricated By | TI |
Process | EPIC-3 |
Technology | CMOS |
Feature Size [μm] | 0.5 |
Channel Length [μm] | 0.5 |
Metal Layers | 4 |
Metal Type | |
FO4 Delay [ps] | 180.0 |
Year | 1995 |
Nominal Vdd | 3.30 |
Vth* | 0.8 |
Designer | Family | Code Name | Model | μarch | Released | Cache | Vdd | Feature Size | FO4 | Clock | TDP | SPECInt 1992 | SPECFp 1992 | SPECInt 1995 | SPECFp 1995 | SPECInt 2000 | SPECFp 2000 | SPECInt 2006 | SPECFp 2006 | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Sun | UltraSPARC | Spitfire | UltraSPARC | 1995-11-01 | 32 | 3.30 | 0.5 | 180.0 | 143.0 | 4.8 | 7.8 | details | ||||||||
Sun | UltraSPARC | Spitfire | UltraSPARC | 1995-11-01 | 32 | 3.30 | 0.5 | 180.0 | 167.0 | 5.5 | 8.8 | details | ||||||||
Sun | UltraSPARC | Spitfire | UltraSPARC | 1995-11-01 | 32 | 3.30 | 0.5 | 180.0 | 200.0 | 6.8 | 10.4 | details | ||||||||
Sun | UltraSPARC | Spitfire | UltraSPARC | 1995-11-01 | 32 | 3.30 | 0.5 | 180.0 | 248.0 | 8.6 | 13.6 | details | ||||||||
Sun | UltraSPARC | Spitfire | UltraSPARC | 1995-11-01 | 32 | 3.30 | 0.5 | 180.0 | 296.0 | 10.3 | 16.7 | details |