Process Technology | |
---|---|
Fabricated By | TI |
Process | http://cpudb.stanford.edu/technologies/96 |
Technology | CMOS |
Feature Size [μm] | 0.065 |
Channel Length [μm] | 0.035 |
Metal Layers | 11 |
Metal Type | |
FO4 Delay [ps] | 12.6 |
Year | 2007 |
Nominal Vdd | 1.10 |
Vth* | 0.4 |
Designer | Family | Code Name | Model | μarch | Released | Cache | Vdd | Feature Size | FO4 | Clock | TDP | SPECInt 1992 | SPECFp 1992 | SPECInt 1995 | SPECFp 1995 | SPECInt 2000 | SPECFp 2000 | SPECInt 2006 | SPECFp 2006 | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Sun | UltraSPARC T2 | Niagara 2 | 2007-07-01 | 4096 | 1.10 | 0.065 | 12.6 | 1400.0 | 84.0 | details |