| Process Technology | |
|---|---|
| Fabricated By | TI |
| Process | http://cpudb.stanford.edu/technologies/93 |
| Technology | CMOS |
| Feature Size [μm] | 0.8 |
| Channel Length [μm] | 0.8 |
| Metal Layers | 2 |
| Metal Type | |
| FO4 Delay [ps] | 288.0 |
| Year | 1991 |
| Nominal Vdd | 5.00 |
| Vth* | 1.0 |
| Designer | Family | Code Name | Model | μarch | Released | Cache | Vdd | Feature Size | FO4 | Clock | TDP | SPECInt 1992 | SPECFp 1992 | SPECInt 1995 | SPECFp 1995 | SPECInt 2000 | SPECFp 2000 | SPECInt 2006 | SPECFp 2006 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Sun | microSPARC I | Tsunami | 1991-06-01 | 4 | 5.00 | 0.8 | 288.0 | 50.0 | 4.0 | details |