Intel Core i7 975
Bloomfield, 3333.0 MHz
| Specifications | |
|---|---|
| Designer | Intel |
| Family | Core i7 |
| Model | 975 |
| Code Name | Bloomfield |
| Clock [MHz] | 3333.0 |
| Max Clock (Turbo) [MHz] | 3600.0 |
| Physical Details | |
|---|---|
| Voltage (Nom.) [V] | 1.09 |
| TDP [W] | 130.0 |
| Die Size [mm²] | 263 |
| Transistor [M] | 731.0 |
| Architecture | |
|---|---|
| Data Path Width | 64 |
| Cores per Chip | 4 |
| Threads per Core | 2 |
| Microarchitecture | |
|---|---|
| µarch | Nehalem |
| ISA | x86-64 |
| FP Pipe Stages | 16 |
| Int Pipe Stages | 16 |
| Cache (on-chip) | |
|---|---|
| L1 Unified Cache | |
| L1 Instruction Cache | 32 |
| L1 Data Cache | 32 |
| L2 Cache | 1024 |
| L3 Cache | 8192 |
| Cache (off-chip) | |
|---|---|
| L1 Unified Cache | |
| L1 Instruction Cache | |
| L1 Data Cache | |
| L2 Cache | |
| L3 Cache | |
| Process Technology | |
|---|---|
| Fabricated By | Intel |
| Process | http://cpudb.stanford.edu/technologies/61 |
| Technology | CMOS |
| Feature Size [μm] | 0.045 |
| Channel Length [μm] | 0.035 |
| Metal Layers | 9 |
| Metal Type | copper |
| FO4 Delay [ps] | 12.6 |
Die Photo
