IBM PowerPC 603ev
300.0 MHz
| Specifications | |
|---|---|
| Designer | IBM |
| Family | PowerPC 603ev |
| Model | |
| Code Name | |
| Clock [MHz] | 300.0 |
| Max Clock (Turbo) [MHz] | |
| Physical Details | |
|---|---|
| Voltage (Nom.) [V] | 2.50 |
| TDP [W] | 3.5 |
| Die Size [mm²] | 42 |
| Transistor [M] | 2.6 |
| Architecture | |
|---|---|
| Data Path Width | 32 |
| Cores per Chip | 1 |
| Threads per Core | 1 |
| Cache (on-chip) | |
|---|---|
| L1 Unified Cache | |
| L1 Instruction Cache | 16 |
| L1 Data Cache | 16 |
| L2 Cache | |
| L3 Cache | |
| Cache (off-chip) | |
|---|---|
| L1 Unified Cache | |
| L1 Instruction Cache | |
| L1 Data Cache | |
| L2 Cache | |
| L3 Cache | |
| Process Technology | |
|---|---|
| Fabricated By | IBM |
| Process | http://cpudb.stanford.edu/technologies/41 |
| Technology | CMOS |
| Feature Size [μm] | 0.35 |
| Channel Length [μm] | 0.35 |
| Metal Layers | 5 |
| Metal Type | |
| FO4 Delay [ps] | 126.0 |
Die Photo
