IBM
Power3-II
400.0
MHz
Specifications
|
Designer |
IBM |
Family |
Power3-II |
Model |
|
Code Name |
|
Clock [MHz] |
400.0 |
Max Clock (Turbo) [MHz] |
|
Physical Details
|
Voltage (Nom.) [V] |
|
TDP [W] |
|
Die Size [mm²] |
170 |
Transistor [M] |
23.0 |
Architecture |
Data Path Width |
64 |
Cores per Chip |
1 |
Threads per Core |
1 |
Cache (on-chip) |
L1 Unified Cache |
|
L1 Instruction Cache |
32 |
L1 Data Cache |
64 |
L2 Cache |
|
L3 Cache |
|
Cache (off-chip) |
L1 Unified Cache |
|
L1 Instruction Cache |
|
L1 Data Cache |
|
L2 Cache |
4096 |
L3 Cache |
|
Process Technology |
Fabricated By |
IBM |
Process |
CMOS-7S |
Technology |
CMOS |
Feature Size [μm] |
0.22 |
Channel Length [μm] |
0.22 |
Metal Layers |
6 |
Metal Type |
copper |
FO4 Delay [ps] |
79.2
|
SpecFp1995
Tomcatv |
Swim |
Su2cor |
Hydro2d |
Mgrid |
Applu |
Turb3d |
Apsi |
Fpppp |
Wave5 |
|
56.7 |
76.4 |
31.4 |
31.7 |
42.8 |
27.4 |
57.1 |
34.3 |
67.1 |
63.0 |
source |
SpecInt2000
Gzip |
Vpr |
Gcc |
Mcf |
Crafty |
Parser |
Eon |
Perlbmk |
Gap |
Vortex |
Bzip2 |
Twolf |
|
193.0 |
218.0 |
287.0 |
309.0 |
254.0 |
146.0 |
245.0 |
205.0 |
233.0 |
302.0 |
208.0 |
342.0 |
source |
226.0 |
258.0 |
292.0 |
297.0 |
278.0 |
182.0 |
355.0 |
233.0 |
257.0 |
311.0 |
255.0 |
357.0 |
source |
SpecFp2000
Wupwise |
Swim |
Mgrid |
Applu |
Mesa |
Galgel |
Art |
Equake |
Facerec |
Ammp |
Lucas |
Fma3d |
Sixtrack |
Apsi |
|
327.0 |
217.0 |
294.0 |
325.0 |
288.0 |
309.0 |
458.0 |
545.0 |
221.0 |
225.0 |
266.0 |
319.0 |
208.0 |
285.0 |
source |
587.0 |
386.0 |
304.0 |
319.0 |
285.0 |
635.0 |
507.0 |
533.0 |
374.0 |
243.0 |
267.0 |
331.0 |
198.0 |
290.0 |
source |