| Process Technology | |
|---|---|
| Fabricated By | TI |
| Process | http://cpudb.stanford.edu/technologies/95 |
| Technology | CMOS |
| Feature Size [μm] | 0.09 |
| Channel Length [μm] | 0.053 |
| Metal Layers | 9 |
| Metal Type | copper |
| FO4 Delay [ps] | 19.1 |
| Year | 2005 |
| Nominal Vdd | 1.10 |
| Vth* | 0.4 |
| Designer | Family | Code Name | Model | μarch | Released | Cache | Vdd | Feature Size | FO4 | Clock | TDP | SPECInt 1992 | SPECFp 1992 | SPECInt 1995 | SPECFp 1995 | SPECInt 2000 | SPECFp 2000 | SPECInt 2006 | SPECFp 2006 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Sun | UltraSPARC T1 | Niagara | UltraSPARC T1 | 2005-07-01 | 3072 | 1.10 | 0.09 | 19.1 | 1400.0 | 72.0 | details |