| Process Technology | |
|---|---|
| Fabricated By | TI |
| Process | http://cpudb.stanford.edu/technologies/102 |
| Technology | CMOS |
| Feature Size [μm] | 0.13 |
| Channel Length [μm] | |
| Metal Layers | 6 |
| Metal Type | aluminum |
| FO4 Delay [ps] | 25.2 |
| Year | 2001 |
| Nominal Vdd | 1.65 |
| Vth* | 0.5 |
| Designer | Family | Code Name | Model | μarch | Released | Cache | Vdd | Feature Size | FO4 | Clock | TDP | SPECInt 1992 | SPECFp 1992 | SPECInt 1995 | SPECFp 1995 | SPECInt 2000 | SPECFp 2000 | SPECInt 2006 | SPECFp 2006 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Sun | UltraSPARC III | Cheetah | UltraSPARC III | 2000-09-01 | 96 | 1.60 | 0.13 | 25.2 | 750.0 | 367.6 | 337.7 | details | ||||||||
| Sun | UltraSPARC III | Cheetah | UltraSPARC III | 2000-09-01 | 96 | 1.70 | 0.13 | 25.2 | 900.0 | 460.9 | 566.9 | details |